Actives
Sirton-Tech has headquarter in Switzerland with operations in Switzerland, Hungary, Slovenia, Romania and Israel. The company was founded as an independent components distributor of the manufacturers listed below. Select the required parts from our manufacturer you need to keep your production running smoothly. Once you determine the specific part you are looking for, feel free to give us a call or ask for a quote in mail. 
Linecard: ADI, TI, MAXIM, SILICON LAB, AMPHENOL, MICROCHIP, CYPRESS, LATTICE, LINEAR TECH, MICREL, NXP, ALTERA, XILINX, INTERSIL, ST MICRO, TDK LAMBDA, FISCHER CONNECTROS, SAMSUNG, AVX, TAYO YUDEN, NICHICON, DECA, NELTRON, HIROSE, OMRON
PCB
Our partner offers a complete service from design and manufacturing of printed circuit board to assembly. The high-quality PCB prototype (single or double-sided) can be produced in 24 hours. To make professional and advanced circuit boards, they are committed to adhering to the strictest standards during PCB manufacturing process.
| Description | Capability |
| Board type | SS – Single sided DS – Double sided ML – Multilayer |
| Basic material | FR4, CEM1, MCS (Al ), MCS (Cu) PTFE, RF IZOKART (Pertinaks), VITROPLAST |
| Thermal stability | Tg 130 (standardized for SS in DS), Tg 150 (standard for ML) |
| Thermal conductivity | 0,3 W/m°C 2,0 W/m°C (standard) 5,0 W/m°C |
| Basic material producers | Kingboard, Nanya, Isola, Rogers, Bergquist, … |
| No. of conductive layers | Up to 12 |
| Maximal working panel | 500 x 600 mm |
| Total board thickness | 0,2mm – 5.0mm |
| Inner layer thickness | 0,08mm – 3,2mm (80 µm – 3,2mm) |
| Minimal line width, space | 70 µm (70 µm) |
| Copper foil thickness on outer layers | 18 µm, 35 µm, 70 µm, 105 µm |
| Drilling diameters (non- metalized) |
0,15 mm – 6,4 mm |
| Types of drillings | Through hole Blind via hole Buried via hole Half holes |
| Blind vias aspect ratio | 1:1 |
| Solder resist | Green: matt, glossy Black: matt, semi matt White – for LED aplication Blue Red Yellow |
| Minimal gap in fine pitch | 70 µm |
| Legend print | White Green Yellow Black Red Blue |
| Peelable resist | Red |
| Tented via | With solder resist |
| Filled via | With non conductive paste, according to IPC-4761 – 6a + 6b + 7 |
| Surface protections | HAL – lead free ( RoHS ) Immersion Ni. Au ( ENIG ) Immersion Ag Immersion Sn galvanic Au ( Hard Gold ) |
| Mechanical tolerances | According to DIN ISO 2768 T1 standard Final product thickness +/-10% |
| Etching tolerances | +/-20% ( +/-10% ) |
| Special features | Blind via Buried via PRESSFIT Side plating Side drilling (half holes ) Jump scoring Countersink (plated and non plated holes) |
| Other advantages | Fast prototyping -24h (SS, DS) Fast protyping ML -48h Fast production of small series -72h AOI – for each and every produced part RoHS production EU origin of goods, certificates for the materials UL conformance Quality according to ISO 9001:2015 Technical back-up Vacuum packing with ESD protection High quality, professional service, fast delivery |